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High Stability MEMS Gyroscope Chip for MEMS IMU & Inertial Navigation Systems

Brand Name:	Firepower
Model Number:	MGZ221HC
MOQ:	1
Price:	negotiable
Payment Terms:	T/T
Supply Ability:	500/month

Detail Information

Product Description

Detail Information

Place of Origin:

china

Product Name:

GYRO PCB

Range:

400deg/s

Band Width:

>200Hz

Resolution:

24 Bits

Scale Factor:

16000 Lsb/deg/s

Delay(customized):

<1.5ms

Bias Instability:

0.5deg/h

Packaging Details:

sponge+box

Supply Ability:

500/month

Highlight:

MEMS gyroscope chip for IMU

high stability gyroscope for navigation

MEMS inertial navigation system chip

Product Description

High Stability MEMS Gyroscope Chip for MEMS IMU & Inertial Navigation Systems

MEMS Gyro Chips Fiber Optic Gyro PCB for High Precision Navigation

The decoupling capacitors for pins VCP, VREF, VBUF, and VREG should be placed as close to the pins as possible, and the equivalent resistance of the traces should be minimized.

The other ends of the decoupling capacitors for VREF, VBUF, and VREG are connected to the nearest AVSS_LN and then to signal ground via a magnetic bead.
The decoupling capacitors for VCC and VIO are also placed close to the corresponding pins. When VCC is in normal operation, the overall current will be about 35 mA, which requires a wide PCB trace to ensure voltage stability.
For smooth assembly of the device, try to avoid routing under the package.
Locate components to avoid areas of stress concentration. It is necessary to avoid large heat dissipation elements and areas with external mechanical contact, extrusion and pulling, as well as areas where positioning screws are prone to warping during overall installation.

Product Parameters

Performance		MGZ332HC-P1	MGZ332HC-P5	MGZ318HC-A1	MGZ221HC-A4	MGZ330HC-O1	MGZ330HC-A1
Range	deg/s	400	400	400	400	400	100
Band Width @3DB customized	Hz	90	180	200	200	300	50
Output accuracy(digital SPI)	bits	24	24	24	24	24	24
Output rate(ODR)(customized)	Hz	12K	12K	12K	12K	12K	12K
Delay(customized)	ms	<3	<1.5	<1.5	<1.5	<1	<6
Bias stability	deg/hr(1o)	<0.05	<0.05	<0.1	<0.5	<0.1	<0.02
Bias stability (1σ 10s)	deg/hr(1o)	<0.5	<0.5	<1	<5	<1	<0.1
Bias stability (1σ 1s)	deg/hr(1o)	<1.5	<1.5	<3	<15	<3	<0.3
Bias error over temperature (1σ)	deg/hr(1o)	<5	<5	<10	<30	10	5
Bias temperature variations, calibrated(1σ)	deg/hr(1o)	<0.5	<0.5	<1	<10	<1	<0.5
Bias repeatability	deg/hr(1o)	<0.5	<0.5	<0.5	<3	<0.3	<0.1
Scale factor at 25°C	lsb/deg/s	20000	20000	16000	16000	20000	80000
Scale factor repeatability (1σ)	ppm(1o)	<20ppm	<20ppm	<20ppm	<20ppm	<100ppm	<100ppm
Scale factor vs temperature (1σ)	ppm(1o)	100ppm	100ppm	<100ppm	<100ppm	<300ppm	<300ppm
Scale factor non-linearity (1σ)	ppm	100ppm	100ppm	<150ppm	<150ppm	<300ppm	<300ppm
Angular random walk(ARW)	°/√h	<0.025	<0.025	<0.05	<0.25	<0.05	<0.005
Noise(Peak to Peak)	deg/s	<0.15	<0.3	<0.35	<0.4	<0.25	<0.015
GValue sensitivity	°/hr/g	<1	<1	<1	<3	<1	<1
Vibration rectification error(12gRMS,20-2000)	°/hr/g(rms)	<1	<1	<1	<3	<1	<1
Power-on time (valid data)	s	750m
Sensor Resonant Frequency	hz	10.5k-13.5K

Environmental suitability

Impact (power on): 500g, 1ms
Impact resistance (power off): 10000g, 10ms
Vibration(power on): 18g rms (20Hz to 2kHz)
Working temperature: -40℃ to +85℃
Store temperature: -55℃ to +125℃
Supply voltage: 5±0.25V
Current consumption: 45ma

Installation

High-performance MEMS gyroscope is a high-precision test equipment. In order to achieve the best effect of design, it is recommended to consider the following aspects when installing the device on the PCB board:

In order to evaluate and optimize the placement of the sensor on the PCB, it is recommended to consider the following aspects and use additional tools during the design phase:
- On the thermal side
- For mechanical stress: bending measurement and/or finite element simulation
- Robustness to impact: After the PCB of the target application has been soldered in the recommended manner, a drop test is performed
It is recommended to maintain a reasonable distance between the mounting position of the sensor on the PCB and the key points described below (the exact value of "reasonable distance" depends on many customer-specific variables and must therefore be determined on a case-by-case basis):
- It is generally recommended to keep the PCB thickness to a minimum (recommended: 1.6 ~ 2.0 mm), because the inherent stress of a thin PCB board is small
- It is not recommended to place the sensor directly under the button or close to the button because of mechanical stress
- It is not recommended to place the sensor near a very hot spot, such as a controller or graphics chip, as this can heat the PCB board and cause the temperature of the sensor to rise