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Low Drift High-Performance FOG Rate Sensor with Customized MEMS Gyro Chip

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Low Drift  High-Performance FOG Rate Sensor with Customized MEMS Gyro Chip
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Features
Specifications
Product Name: GYRO PCB
Range: 100deg/s
Band Width: >50Hz
Resolution: 24 Bits
Scale Factor: 80000 Lsb/deg/s
Delay(customized): <6ms
Bias Instability: 0.02deg/h
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Low Drift FOG Rate Sensor

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High-Performance FOG Rate Sensor

Basic Infomation
Place of Origin: china
Brand Name: avic
Model Number: MGZ330HC
Payment & Shipping Terms
Packaging Details: sponge+box
Delivery Time: 7 days for sample
Payment Terms: T/T
Supply Ability: 500/month
Product Description

Low Drift  High-Performance FOG Rate Sensor with Customized MEMS Gyro Chip

 

Low Drift  High-Performance FOG Rate Sensor with Customized MEMS Gyro Chip 0

 

PCB design:

The decoupling capacitors for pins VCP, VREF, VBUF, and VREG should be placed as close to the pins as possible, and the equivalent resistance of the traces should be minimized.  The other ends of the decoupling capacitors for VREF, VBUF, and VREG are connected to the nearest AVSS _ LN and then to signal ground via a magnetic bead.  The decoupling capacitors for VCC and VIO are also placed close to the corresponding pins. When VCC is in normal operation, the overall current will be about 35 mA, which requires a wide PCB trace to ensure voltage stability.  For smooth assembly of the device, try to avoid routing under the package.  Locate components to avoid areas of stress concentration. It is necessary to avoid large heat dissipation elements and areas with external mechanical contact, extrusion and pulling, as well as areas where positioning screws are prone to warping during overall installation.

 

About product

performance   MGZ332HC-P1 MGZ332HC-P5 MGZ318HC-A1 MGZ221HC-A4 MGZ330HC-O1 MGZ330HC-A1
Range deg/s 400 400 400 400 400 100
Band Width @3DB customized) Hz 90 180 200 200 300 50
Output accuracy(digital SPI) bits 24 24 24 24 24 24
Output rate(ODR)(customized) Hz 12K 12K 12K 12K 12K 12K
Delay(customized) ms <3 <1.5 <1.5 <1.5 <1 <6
Bias stability deg/hr(1o) <0.05 <0.05 <0.1 <0.5 <0.1 <0.02
Bias stability (1σ 10s) deg/hr(1o) <0.5 <0.5 <1 <5 <1 <0.1
Bias stability (1σ 1s) deg/hr(1o) <1.5 <1.5 <3 <15 <3 <0.3
Bias error over temperature (1σ) deg/hr(1o) <5 <5 <10 <30 10 5
Bias temperature variations, calibrated(1σ) deg/hr(1o) <0.5 <0.5 <1 <10 <1 <0.5
Bias repeatability deg/hr(1o) <0.5 <0.5 <0.5 <3 <0.3 <0.1
Scale factor at 25°C lsb/deg/s 20000 20000 16000 16000 20000 80000
Scale factor repeatability (1σ) ppm(1o) <20ppm <20ppm <20ppm <20ppm <100ppm <100ppm
Scale factor vs temperature (1σ) ppm(1o) 100ppm 100ppm <100ppm <100ppm <300ppm <300ppm
Scale factor non-linearity (1σ) ppm 100ppm 100ppm <150ppm <150ppm <300ppm <300ppm
Angular random walk(ARW) °/√h <0.025 <0.025 <0.05 <0.25 <0.05 <0.005
Noise(Peak to Peak) deg/s <0.15 <0.3 <0.35 <0.4 <0.25 <0.015
GValue sensitivity °/hr/g <1 <1 <1 <3 <1 <1
Vibration rectification error(12gRMS,20-2000) °/hr/g(rms) <1 <1 <1 <3 <1 <1
Power-on time (valid data) s 750m
Sensor Resonant Frequency hz 10.5k-13.5K
Environmental suitability  
Impact (power on) 500g , 1ms
Impact resistance (power off) 10000g , 10ms
vibration(power on) 18g rms (20Hz to 2kHz)
Working temperature -40℃----+85℃
Store temperature -55℃----+125℃
Supply voltage 5±0.25V
Current consumption 45ma

 

 

 

 

Low Drift  High-Performance FOG Rate Sensor with Customized MEMS Gyro Chip 1

Installation

High-performance MEMS gyroscope is a high-precision test equipment. In order to achieve the best effect of design, it is recommended to consider the following aspects when installing the device on the PCB board: 1. In order to evaluate and optimize the placement of the sensor on the PCB, it is recommended to consider the following aspects and use additional tools during the design phase:  On the thermal side;  For mechanical stress: bending measurement and/or finite element simulation;  Robustness to impact: After the PCB of the target application has been soldered in the recommended manner, a drop test is performed. 2. It is recommended to maintain a reasonable distance between the mounting position of the sensor on the PCB and the key points described below (the exact value of "reasonable distance" depends on many customer-specific variables and must therefore be determined on a case-by-case basis):  It is generally recommended to keep the PCB thickness to a minimum (recommended: 1.6 ~ 2.0 mm), because the inherent stress of a thin PCB board is small;  It is not recommended to place the sensor directly under the button or close to the button because of mechanical stress;  It is not recommended to place the sensor near a very hot spot, such as a controller or graphics chip, as this can heat the PCB board and cause the temperature of the sensor to rise.

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